TONGZHAN INDUSTRIAL LIMITED
TONGZHAN INDUSTRIAL LIMITED
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Producibility Printed Circuit Board Design Multi-Layer Gold Finger Plating
Printed Circuit Board Design Description:
1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.
Printed Circuit Board Design Parameters:
| SMT Capability | 14 million spots per day |
| SMT Lines | 12 SMT lines |
| Reject Rate | R&C: 0.3% |
| IC: 0% | |
| PCB Board | POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards |
| Parts Dimension | Min BGA Footprint:03015 Chip/0.35mm BGA |
| Parts SMT Accuracy:±0.04mm | |
| IC SMT Accuracy:±0.03mm | |
| PCB Dimension | Size:50*50mm-686*508mm |
| Thickness: 0.3-6.5mm |
Printed Circuit Board Design Introduction:
PCB (printed circuit board) is a printed circuit board, referred to as a printed circuit board, and is one of the important components of the electronics industry. Almost every electronic device, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to make the electrical interconnection between various components, use printed circuit boards. plate. The printed circuit board consists of an insulating base plate, connecting wires, and pads for assembling and soldering electronic components, and has the dual functions of a conductive circuit and an insulating base plate. It can replace complex wiring and realize the electrical connection between components in the circuit, which not only simplifies the assembly and welding of electronic products, reduces the workload of wiring in the traditional way, and greatly reduces the labor intensity of workers; it also reduces the size of the whole machine. volume, reduce product cost, and improve the quality and reliability of electronic equipment.
